PRODUCT
Inspection and automation systems for diverse industries, powered by core OCT technology
CORE TECHNOLOGY · SEMICONDUCTOR & ELECTRONICS
Precision inspection technology optimized for semiconductor processes
We provide optical imaging and high-speed vision inspection technologies that detect internal and external defects in wafers and packages without contact.
-
- Optical Imaging (OCT)
- Generates micrometer-scale internal 3D tomographic images using non-contact, non-destructive methods.
-
- X-ray Vision
- Detects internal defects and bonding conditions that are difficult to observe externally at high resolution.
-
- Precision Automation
- Integrates inspection and processing in a single system using high-precision transport and alignment mechanisms.
-
Semiconductor & ElectronicsTomoPro Series
OCT-based non-contact 3D internal tomographic inspection system
- Axial ResolutionMinimum 1.9 µm (850 HR)
- Wavelength Options850 / 1060 / 1310 nm
Learn More -
Semiconductor & ElectronicsX-ray Optical Vision Module
X-ray optical vision module for internal defect detection
- FOV (4× lens)10 × 13 mm
- Resolution (4× lens)0.8 μm/pixel
Learn More